Background and challenges
Integrated Circuits packaging
Archive REF: E3400 V2
Background and challenges
Integrated Circuits packaging

Author : Jean-Luc DIOT

Publication date: August 10, 2017 | Lire en français

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1. Background and challenges

1.1 The role of packaging

Microelectronic chip packaging establishes the interconnections and environment required for integrated circuits to process or store information. It is in fact the first level of packaging for a conventional microelectronic system. For more information, please refer to [E 3 401] . Packaging involves a number of scientific and technical skills, including :

  • electronics, which deals with...

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