Conclusion

Packaging has accompanied the evolution of microelectronics applications, from the infrastructure electronics of the 80s to today's mobile applications. New applications don't replace existing markets and, consequently, new packages don't replace existing ones; for example, generic SMD packages (SO or LQFP type) will continue to endure for decades.

The Internet of Things (IoT) is set to take up where mobile applications left off, first with the cell phone and then the smartphone. Weight reduction and greater integration will therefore continue to be key trends. This should not, however, translate into a reduction in package output pitches. Indeed, pitches of between 0.35 and 0.5mm seem to be the limit to avoid increasing PCB prices too much. On the other hand, the reduction in case thickness is likely to be more pronounced, with the integration of passives or simple...