Background and developments
Packaging and interconnection processes for electronics components
Article REF: E3401 V1
Background and developments
Packaging and interconnection processes for electronics components

Author : Gilles POUPON

Publication date: April 10, 2016, Review date: February 21, 2023 | Lire en français

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1. Background and developments

1.1 Issues

The invention of the transistor in 1947 revolutionized the electronics industry. In 1959, Jack Kilby developed the first integrated circuit incorporating two transistors and a resistor. Today, the world of semiconductors represents a colossal market and the most important industrial sector. But what role does electronic packaging play in this huge market, and what are the main trends today? It is estimated that packaging and testing account for around 50% of the price of a finished component.

The evolution of electronic components is governed by a number of constraints: reduction of manufacturing costs and time-to-market, miniaturization (smaller components, several levels of integration) and functionality (increased performance, more functions)....

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