Table of acronyms
Packaging and interconnection processes for electronics components

Article REF: E3401 V1

Table of acronyms
Packaging and interconnection processes for electronics components

Author : Gilles POUPON

Publication date: April 10, 2016, Review date: February 21, 2023 | Lire en français

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8. Table of acronyms

The use of English terms is essential, as they are used on a daily basis by the French-speaking tradesman.

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Table of acronyms

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Bibliography

POUPON (G.) - Packaging avancé sur silicium – - Traité EGEM – Lavoisier (2008) – ISBN 978-2-7462-1950-2.
POUPON (G.) - Traitement des puces électroniques et nouveaux procédés d'interconnexion – - Traité EGEM – Lavoisier (2011) – ISBN 978-2-7462-2085-0....

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