5. 3D integration
5.1 Issues
One of the challenges facing the semiconductor industry is to respond simultaneously to the race for integration, improved performance and lower costs. These challenges have guided the roadmaps of the main foundries, and have led to major technological advances. For example, the reduction in the size of components has made it possible to increase speed of execution and improve the performance of components predicted by Moore's Law (performance doubles every 18 months); we are now able to manufacture chips with more than a billion transistors.
3D (three-dimensional) integration allows us to go beyond Moore's Law for components. This technology, which consists in stacking components, allows systems to be miniaturized and interconnection densities to...
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3D integration
Conclusion
Bibliography
Publications and reviews
IEEE Transactions on Components, Packaging and Manufacturing Technology, https://www.cpmt.org
Chip Scale Review – Haley Publishing – https://www.chipscalereview.com
Électronique Mag – Tracks and tablets – Éditions Alain...
Events
ECTC (Electronic Components and Technology Conference) organized by IEEE CPMT – http://www.ectc.net
IMAPS International Symposium on Microlectronics http://www.imaps.org
Standards
IPC: Association Connecting Electronics Industries http://www.ipc.org/
JEDEC (Joint Electron Device Engineering Council) – http://www.jedec.org
Directory
International networks – Organizations – Federations – Associations (non-exhaustive list)
ITRS – International Technology Roadmap for Semiconductors – http://www.itrs.net/home.html
iNEMI – International Electronics Manufacturing Initiative – http://www.inemi.org
...Semiconductor market trends
Little by little, the conventional type of individually packaged chips is evolving towards more compact solutions, improving performance and enabling greater functionality. Table 1 shows the expected evolution of package type between 2011 and 2018...
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