3. Packaging categories

In the article on integrated circuit packaging [E 3400] , two assembly processes for individual components (SMD and MCM) were presented. In this chapter, we describe their assembly processes, as well as those for chips connected directly to each other, but also in packages and collectively. In fact, to meet the extremely varied demands of different applications and markets, it is necessary to bring together a number of different technologies. Whereas in the past, packaging essentially consisted of interconnecting elementary components (transistor wires, passive components, etc.), the move towards...