1. Basic principles
1.1 Connection processes
A chip can be assembled and connected in a "system in package", on a substrate or on a board, in a number of different ways. Two techniques are the most widespread.
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Wired connection
The wire bonding technique has been developed over many years. Once a chip has been positioned and glued to its future substrate, this technique enables the chip to be electrically connected by means of a wire soldered around its periphery (figure 1 ).
More than 90% of electronic components are connected using this method, since automatic machines operating at very high speeds (>...
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Basic principles
Description of the flip chip process
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