4. Production of fusible microbeads for soldering
The terminal block must perform 4 functions:
the electrical connection between the component to be assembled and its support;
removal of heat dissipated by the chip;
environmental protection ;
structural bonding between chip and substrate.
The material and process selected have a direct impact on system performance. The table at 4 lists the most frequently used ball materials and their main characteristics:
4.1 Fusible alloys
Fusible alloys are at the heart of the problem; several methods are used to deposit the alloy,...
Exclusive to subscribers. 97% yet to be discovered!
Already subscribed? Log in!
Production of fusible microbeads for soldering
Choice of manufacturing process
Article included in this offer
"Metal treatments"
(
128 articles
)
Updated and enriched with articles validated by our scientific committees
A set of exclusive tools to complement the resources
References
Exclusive to subscribers. 97% yet to be discovered!
Already subscribed? Log in!
