Article | REF: E2080 V2

Non linear resistors, Thermistors

Authors: Alain BEAUGER, Alain LAGRANGE

Publication date: February 10, 2015 | Lire en français

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    Overview

    ABSTRACT

    This article deals with the performance of semi-conducting ceramic component belonging to the non-linear resistance category, whose resistance varies with temperature. Two types of components are presented: negative temperature coefficient thermistors (NTCs), and positive temperature coefficient thermistors (PTCs). For each family, the article looks at physical and chemical properties of materials, manufacturing processes for powders and ceramic sensors, electrical properties, and the use of components in different industrial sectors. A section describes the development of ceramic components according to current electronic circuit requirements and new applications.

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    AUTHORS

    • Alain BEAUGER: PhD in Chemistry-Physics, R Engineer at TPC AVX Corporation, Dijon, France

    • Alain LAGRANGE: D. in Electronics, former Marketing Manager for Research and Development at Thomson-LCC, Dijon, France

     INTRODUCTION

    Non-linear resistors belong to the family of passive electronic components and, thanks to their unique properties, are used in many areas of electronics. They are characterized by their high sensitivity to temperature, a major drawback for electronic components, but one that is exploited and even reinforced in the case of non-linear resistors.

    They are used as series protection elements for electronic circuits, current limiters, temperature detectors and regulators, heating elements, etc.

    The special properties of these polycrystalline semiconductors are mainly linked either to the intrinsic characteristics of the crystallites (negative-temperature-coefficient thermistors) or to the characteristics of the grain boundaries (positive-temperature-coefficient thermistors).

    This article summarizes the main properties of ceramic thermistors, and shows how recent developments in powder technology and forming methods can be applied to this type of component for use in high-performance electronic applications.

    The ever-increasing demand for these components is due to their low cost, ease of assembly and thermal sensitivity. Current technical developments are geared towards miniaturization, and in particular the presentation of these components in the form of "chips" adapted to surface-mount technology on printed circuit boards.

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