2. Assembly and interconnection categories
Circuit assembly is the first step after substrate fabrication and cutting. It is defined as the process of electrically connecting the chip's input/output (I/O) pads. Assembly consists of three parts:
the chip's metal stud,
a metal connecting element between the chip and its substrate,
the metal stud on the package.
At the interface between chip and system, this assembly must meet five essential criteria:
have "acceptable" electrical properties (in terms of capacitance, resistance and inductance),
be a low-cost solution,
be easy to industrialize and have a high manufacturing capacity,
be reliable,...
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Assembly and interconnection categories
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