7. Glossary
ball :
Bille.
bump:
Bosses that allow contact to be made with a ball.
bonding :
Gluing.
chip :
Chip.
copper pillar :
Copper interconnection often topped with fusible material for brazing.
dicing :
Sawing, chip cutting.
Embedded :
Embedded, buried.
Packaging:
Encapsulation.
flip chip :
Flip chip.
FR4 :
Material used to manufacture CIs.
I/O :...
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Glossary
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