Conclusion

As long as electronic components, subsystems and systems continue to evolve, packaging and interconnection processes will have to adapt. Furthermore, in a connected, protected and communicating society, the growing number of high-performance microsystems operating in specific environments will guide the roadmap in terms of protection (packaging) and communication (interconnections).

Reduced manufacturing costs, shorter time-to-market, miniaturization (smaller components, multiple levels of integration), increased functionality and enhanced performance are all criteria that need to be taken into account. In the years to come, wafer-level integrated packaging technologies and 3D integration will be the main developments to meet market needs, but as each product requires a tailored technological solution, technology chains will continue to flourish, taking into account...